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        "body": "<https://www.youtube.com/watch?v=0n0Di5sLCjo>\n\n**Problem**\n\n“For the past 50 years, semiconductor-technology development has felt like walking inside a tunnel. The road ahead was clear, as there was a well-defined path. And everyone knew what needed to be done: shrink the transistor. Now, we have reached the end of the tunnel.\"\\\nH.-S. Philip Wong, Chief Scientist, TSMC, 2024.\n\nToday’s 2D lithography has hit a fundamental wall in feature density, so the semiconductor industry has begun stacking 2D layers to fit more transistors, bits, and bandwidth on each chip. \\\n\\\nBut stacking scales cost exponentially with density, unlike the constant cost days of Moore: a 10-layer high bandwidth memory (HBM) package is \\~5x more expensive than the same amount of un-stacked DRAM.\n\n**Solution**\n\nUsing a 3D process to make today's increasingly 3D integrated circuits could shortcut this problem, scaling process complexity with materials rather than layers and enabling the next decade of continued progress.\n\nOur 3D lithography technology can do this: it is capable of fabricating multi-material 3D structures with 100 nm resolution at wafer scale.\n\nWhere the ability to create more complex forms enables more complex functions, such granular control of matter enables the future of much more than just chips, including biotech, sensing, and advanced materials.\n\nWe recently crossed the cost thresholds that make this technology commercially viable. We will be driving an exponential scaling law in the production capacity of this technology over the coming decade.\n\n**Team**\n\n![](https://lh7-rt.googleusercontent.com/docsz/AD_4nXcMsUlRx_bo7xJvNWmZaC-39OI7Hknw0Y65Er2tjyUh54Sd4--EgCih-wQzZojhTUdUgn2OqKfPxVzmnfqnJGprg2qacYS56K-eYqnSh_n3uz75XB9uyCslMaxReWdNHhKkcVHF?key=cch75ExUod4AOIuWU2xY6A)\n\nWe’re a team of physicists and systems engineers from Caltech and NASA, where we previously matured multiple nascent technologies, winning NASA’s Most Visionary Concept and Best Product Development awards.\\\n\\\n**Advisory Board**\\\nDr. H.-S. Philip Wong: Chief Scientist, TSMC \\\nDr. Eli Yablonovitch: Director Emeritus of the NSF Center for Energy Efficient Electronics Science (E3S)\\\nDr. Julia Greer: Director, Caltech Kavli Nanoscience Institute   \\\nDr. Michael Hochberg: Silicon Photonics Pioneer \\\nDr. Pooya Tadayon: Intel Fellow ",
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        "created_at": "2025-04-22T18:46:21.407Z"
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